PRODUCTS
- Diamond Tools
- HTG-CW1
- HTG-4T
- HTG-3Y
- HTG-3T4K
- HTG-2Y
- HTG-2T
- HTG-2L
- HTG-2C
- Resin polishing pads
- HTG-XE
- HTG-XZ
- HTG-XR
- HTG-MB4
- HTG-CG310
- HTG-C3510
- HTG-C410
- HTG-C310
- PCD Tools
- HTG-2CPCD+1
- HTG-2CPCD
- Burnishing pads
- HTG-DIP-HD027
- Tools Holder
- Cleaning machine
- 260A
- 150A
- 105A
- GW-70A
- GW-55B
- Chemical production
- Related Tools
- Generator
- Joint saw and tools
- Bush hammer
HTG-2CPCD+1
PCD Diamond Grinding Block Polishing Pads with double quarter round PCD. They are high quality to remove soft to extremely hard, thin or thick adhesives, sealers, coatings including the hardest acrylics or epoxies.
PCD grinding pads can effectively remove the residual resin on the floor.
Remove thick coating.
Different kind of PCD grinding pads are suitable for different machines.
It can use for epoxy floor to remove thick coating.
Advantage：
1.It can effectively remove the residual resin on the floor，
and remove thick coating quickly.
2. With diamond segments can strengthening the stability of grinding
3. Effective in the process of concrete floor removal
Specifications：
1. Diamond segment：3-9MM*2*1/4PCD*8mm+1C
2. Thickness：12mm
3. Application：Dry grinding
4. Product packaging：108/Carton box/21kg
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